Production and Characterisation of SLID Interconnected n-in-p Pixel Modules with 75 Micrometer Thin Silicon Sensors

The performance of pixel modules built from 75 micrometer thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding....

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Detalles Bibliográficos
Autores principales: Andricek, L., Beimforde, M., Macchiolo, A., Moser, H.-G., Nisius, R., Richter, R.H., Terzo, S., Weigell, P.
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Nucl. Instrum. Methods Phys. Res., A 2014
Materias:
Detectors and Experimental Techniques
7: Transnational access European irradiation facilities
7.3: Transnational Access to KIT, Germany
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2014.05.046
http://cds.cern.ch/record/1693467

Internet

https://dx.doi.org/10.1016/j.nima.2014.05.046
http://cds.cern.ch/record/1693467

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