A via last TSV process applied to ATLAS pixel detector modules: proof of principle demonstration

Via last Through Silicon Vias (TSVs) can be exploited to build low material modules for the upgrades of the ATLAS pixel detector at the High Luminosity LHC. To prove this concept a via last TSV process is demonstrated on ATLAS pixel readout wafers. Demonstrator modules featuring 90 mm thin readout c...

Deskribapen osoa

Xehetasun bibliografikoak
Egile Nagusiak: Barbero, M, Fritzsch, T, Gonella, L, Hügging, F, Krüger, H, Rothermund, M, Wermes, N
Formatua: info:eu-repo/semantics/article
Hizkuntza:eng
Argitaratua: JINST 2012
Gaiak:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Sarrera elektronikoa:https://dx.doi.org/10.1088/1748-0221/7/08/P08008
http://cds.cern.ch/record/1693480

Internet

https://dx.doi.org/10.1088/1748-0221/7/08/P08008
http://cds.cern.ch/record/1693480

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