A via last TSV process applied to ATLAS pixel detector modules: proof of principle demonstration

Via last Through Silicon Vias (TSVs) can be exploited to build low material modules for the upgrades of the ATLAS pixel detector at the High Luminosity LHC. To prove this concept a via last TSV process is demonstrated on ATLAS pixel readout wafers. Demonstrator modules featuring 90 mm thin readout c...

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Detalles Bibliográficos
Autores principales: Barbero, M, Fritzsch, T, Gonella, L, Hügging, F, Krüger, H, Rothermund, M, Wermes, N
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: JINST 2012
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/7/08/P08008
http://cds.cern.ch/record/1693480

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