SLID-ICV Vertical Integration Technology for the ATLAS Pixel Upgrades

We present the results of the characterization of pixel modules composed of 75 μm thick n-in-p sensors and ATLAS FE-I3 chips, interconnected with the SLID (Solid Liquid Inter-Diffusion) technology. This technique, developed at Fraunhofer-EMFT, is explored as an alternative to the bump-bonding proces...

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Detalles Bibliográficos
Autores principales: Macchiolo, A., Andricek, L., Moser, H.G., Nisius, R., Richter, R.H., Weigell, P.
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Phys. Procedia 2012
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:https://dx.doi.org/10.1016/j.phpro.2012.02.444
http://cds.cern.ch/record/1694330

Internet

https://dx.doi.org/10.1016/j.phpro.2012.02.444
http://cds.cern.ch/record/1694330

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