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Wafer-level chip-scale packaging: analog and power semiconductor applications
This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The...
| Autores principales: | , |
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| Lenguaje: | eng |
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Springer
2015
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| Acceso en línea: | https://dx.doi.org/10.1007/978-1-4939-1556-9 http://cds.cern.ch/record/1968753 |