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Experience on 3D Silicon Sensors for ATLAS IBL
3D silicon sensors, where plasma micro-machining is used to etch deep narrow apertures in the silicon substrate to form electrodes of PIN junctions, represent possible solutions for inner pixel layers of the tracking detectors in high energy physics experiments. This type of sensors has been develop...
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| Formato: | info:eu-repo/semantics/article |
| Lenguaje: | eng |
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JINST
2014
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| Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/10/05/C05001 http://cds.cern.ch/record/1971961 |