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Fundamentals of lead-free solder interconnect technology: from microstructures to reliability

This unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable r...

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Detalles Bibliográficos
Autores principales: Lee, Tae-Kyu, Bieler, Thomas R, Kim, Choong-Un, Ma, Hongtao
Lenguaje:eng
Publicado: Springer 2015
Materias:
Acceso en línea:https://dx.doi.org/10.1007/978-1-4614-9266-5
http://cds.cern.ch/record/1973458