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Production and characterisation of SLID interconnected n-in-p pixel modules with 75 μm thin silicon sensors

The performance of pixel modules built from 75 μm thin silicon sensors and ATLAS read-out chips employing the Solid Liquid InterDiffusion (SLID) interconnection technology is presented. This technology, developed by the Fraunhofer EMFT, is a possible alternative to the standard bump-bonding. It allo...

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Detalles Bibliográficos
Autores principales: Andricek, L, Beimforde, M, Macchiolo, A, Moser, H.G, Nisius, R, Richter, R.H, Terzo, S, Weigell, P
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: Nucl. Instrum. Methods Phys. Res., A 2014
Materias:
Acceso en línea:http://cds.cern.ch/record/1996965