Test results of the first 3D-IC prototype chip developed in the framework of HL-LHC/ATLAS hybrid pixel upgrade

To face new challenges brought by the upgrades of the Large Hadron Collider at CERN and of the ATLAS pixels detector, for which high spatial resolution, very good signal to noise ratio and high radiation hardness is needed, 3D integrated technologies are investigated. In the years to come, the Large...

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Detalles Bibliográficos
Autores principales: Pangaud, P, Arutinov, D, Barbero, M, Bompard, F, Breugnon, P, Clemens, J C, Fougeron, D, Garcia-Sciveres, M, Godiot, S, Hemperek, T, Krüger, H, Obermann, T, Rozanov, S, Wermes, N
Formato: info:eu-repo/semantics/article
Lenguaje:eng
Publicado: JINST 2014
Materias:
Detectors and Experimental Techniques
3: Microelectronics and interconnection technology
3.2: 3D Interconnection
Acceso en línea:https://dx.doi.org/10.1088/1748-0221/9/02/C02031
http://cds.cern.ch/record/1997599

Internet

https://dx.doi.org/10.1088/1748-0221/9/02/C02031
http://cds.cern.ch/record/1997599

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