Cargando…
Flip chip assembly of thinned chips for hybrid pixel detector applications
There is a steady trend to ultra-thin microelectronic devices. Especially for future particle detector systems a reduced readout chip thickness is required to limit the loss of tracking precision due to scattering. The reduction of silicon thickness is performed at wafer level in a two-step thinning...
| Autores principales: | , , , , , , , |
|---|---|
| Formato: | info:eu-repo/semantics/article |
| Lenguaje: | eng |
| Publicado: |
JINST
2014
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/9/05/C05039 http://cds.cern.ch/record/1997607 |