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Wafer bonding: applications and technology
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication method...
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| Lenguaje: | eng |
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Springer
2004
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| Acceso en línea: | https://dx.doi.org/10.1007/978-3-662-10827-7 http://cds.cern.ch/record/2023480 |