Wafer bonding: applications and technology

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication method...

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Detalles Bibliográficos
Autores principales: Alexe, Marin, Gösele, Ulrich
Lenguaje:eng
Publicado: Springer 2004
Materias:
Other Fields of Physics
Acceso en línea:https://dx.doi.org/10.1007/978-3-662-10827-7
http://cds.cern.ch/record/2023480
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author Alexe, Marin
Gösele, Ulrich
author_facet Alexe, Marin
Gösele, Ulrich
author_sort Alexe, Marin
collection CERN
description During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
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institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2004
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spelling cern-20234802021-04-21T20:13:07Zdoi:10.1007/978-3-662-10827-7http://cds.cern.ch/record/2023480engAlexe, MarinGösele, UlrichWafer bonding: applications and technologyOther Fields of PhysicsDuring the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.Springeroai:cds.cern.ch:20234802004
spellingShingle Other Fields of Physics
Alexe, Marin
Gösele, Ulrich
Wafer bonding: applications and technology
title Wafer bonding: applications and technology
title_full Wafer bonding: applications and technology
title_fullStr Wafer bonding: applications and technology
title_full_unstemmed Wafer bonding: applications and technology
title_short Wafer bonding: applications and technology
title_sort wafer bonding: applications and technology
topic Other Fields of Physics
url https://dx.doi.org/10.1007/978-3-662-10827-7
http://cds.cern.ch/record/2023480
work_keys_str_mv AT alexemarin waferbondingapplicationsandtechnology
AT goseleulrich waferbondingapplicationsandtechnology

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