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High Density Interconnect for the CMS Phase 1 Pixel Upgrade: Electrical Test and Visual Inspection
High Density Interconnect (HDI) is the top layer of the pixel module and contains the Token Bit Manager (TBM) which controls the signals sent to and received from the read out chips connected to the sensor. Before being made into a module, the HDI with its TBM goes through an electrical test. This c...
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| Lenguaje: | eng |
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2015
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| Acceso en línea: | http://cds.cern.ch/record/2047480 |