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Low-cost bump-bonding processes for high energy physics pixel detectors
In the next generation of collider experiments detectors will be challenged by unprecedented particle fluxes. Thus large detector arrays of highly pixelated detectors with minimal dead area will be required at reasonable costs. Bump-bonding of pixel detectors has been shown to be a major cost-driver...
| Autores principales: | , , , , , , |
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| Lenguaje: | eng |
| Publicado: |
2015
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1088/1748-0221/11/01/C01050 http://cds.cern.ch/record/2065592 |