Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a p...

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Detalles Bibliográficos
Autores principales: Wong, E-H, Mai, Y-W
Lenguaje:eng
Publicado: Elsevier Science 2015
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/2121505

Internet

http://cds.cern.ch/record/2121505

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