Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a p...

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Detalles Bibliográficos
Autores principales: Wong, E-H, Mai, Y-W
Lenguaje:eng
Publicado: Elsevier Science 2015
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/2121505
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author Wong, E-H
Mai, Y-W
author_facet Wong, E-H
Mai, Y-W
author_sort Wong, E-H
collection CERN
description Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progr
id cern-2121505
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2015
publisher Elsevier Science
record_format invenio
spelling cern-21215052021-04-21T19:55:09Zhttp://cds.cern.ch/record/2121505engWong, E-HMai, Y-WRobust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forcesEngineering Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful progrElsevier Scienceoai:cds.cern.ch:21215052015
spellingShingle Engineering
Wong, E-H
Mai, Y-W
Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
title Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
title_full Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
title_fullStr Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
title_full_unstemmed Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
title_short Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
title_sort robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
topic Engineering
url http://cds.cern.ch/record/2121505
work_keys_str_mv AT wongeh robustdesignofmicroelectronicsassembliesagainstmechanicalshocktemperatureandmoistureeffectsoftemperaturemoistureandmechanicaldrivingforces
AT maiyw robustdesignofmicroelectronicsassembliesagainstmechanicalshocktemperatureandmoistureeffectsoftemperaturemoistureandmechanicaldrivingforces

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