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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture: effects of temperature, moisture and mechanical driving forces
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a p...
| Autores principales: | , |
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| Lenguaje: | eng |
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Elsevier Science
2015
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| Acceso en línea: | http://cds.cern.ch/record/2121505 |