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Carbon nanotubes for interconnects: process, design and applications
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...
| Autores principales: | , , |
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| Lenguaje: | eng |
| Publicado: |
Springer
2017
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| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1007/978-3-319-29746-0 http://cds.cern.ch/record/2240362 |