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3D microelectronic packaging: from fundamentals to applications
This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the...
| Autores principales: | , |
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| Lenguaje: | eng |
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Springer
2017
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| Acceso en línea: | https://dx.doi.org/10.1007/978-3-319-44586-1 http://cds.cern.ch/record/2243831 |