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Area array interconnection handbook
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Springer
2012
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| Acceso en línea: | http://cds.cern.ch/record/2310049 |