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3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and e...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Wiley-IEEE Press
2017
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2318261 |