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3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility
An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and e...
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
Wiley-IEEE Press
2017
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2318261 |
| _version_ | 1780958374571016192 |
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| author | Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason |
| author_facet | Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason |
| author_sort | Hwang, Lih-Tyng |
| collection | CERN |
| description | An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab * Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail * Provides chapter-wise review questions and powerpoint slides as teaching tools |
| id | cern-2318261 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2017 |
| publisher | Wiley-IEEE Press |
| record_format | invenio |
| spelling | cern-23182612021-04-21T18:49:08Zhttp://cds.cern.ch/record/2318261engHwang, Lih-TyngHorng, Tzyy-Sheng Jason3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobilityComputing and ComputersAn interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments * Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility * Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft's Excel and Minitab * Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail * Provides chapter-wise review questions and powerpoint slides as teaching toolsWiley-IEEE Pressoai:cds.cern.ch:23182612017 |
| spellingShingle | Computing and Computers Hwang, Lih-Tyng Horng, Tzyy-Sheng Jason 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility |
| title | 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility |
| title_full | 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility |
| title_fullStr | 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility |
| title_full_unstemmed | 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility |
| title_short | 3D IC and RF SiPs: advanced stacking and planar solutions for 5G mobility |
| title_sort | 3d ic and rf sips: advanced stacking and planar solutions for 5g mobility |
| topic | Computing and Computers |
| url | http://cds.cern.ch/record/2318261 |
| work_keys_str_mv | AT hwanglihtyng 3dicandrfsipsadvancedstackingandplanarsolutionsfor5gmobility AT horngtzyyshengjason 3dicandrfsipsadvancedstackingandplanarsolutionsfor5gmobility |