Cargando…
Microelectronic packaging: interconnection and assembly of integrated circuits
| Autor principal: | |
|---|---|
| Lenguaje: | eng |
| Publicado: |
McGraw-Hill
1968
|
| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/250141 |
| _version_ | 1780885485938278400 |
|---|---|
| author | Sideris, George |
| author_facet | Sideris, George |
| author_sort | Sideris, George |
| collection | CERN |
| id | cern-250141 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 1968 |
| publisher | McGraw-Hill |
| record_format | invenio |
| spelling | cern-2501412021-04-22T03:54:52Zhttp://cds.cern.ch/record/250141engSideris, GeorgeMicroelectronic packaging: interconnection and assembly of integrated circuitsEngineeringMcGraw-Hilloai:cds.cern.ch:2501411968 |
| spellingShingle | Engineering Sideris, George Microelectronic packaging: interconnection and assembly of integrated circuits |
| title | Microelectronic packaging: interconnection and assembly of integrated circuits |
| title_full | Microelectronic packaging: interconnection and assembly of integrated circuits |
| title_fullStr | Microelectronic packaging: interconnection and assembly of integrated circuits |
| title_full_unstemmed | Microelectronic packaging: interconnection and assembly of integrated circuits |
| title_short | Microelectronic packaging: interconnection and assembly of integrated circuits |
| title_sort | microelectronic packaging: interconnection and assembly of integrated circuits |
| topic | Engineering |
| url | http://cds.cern.ch/record/250141 |
| work_keys_str_mv | AT siderisgeorge microelectronicpackaginginterconnectionandassemblyofintegratedcircuits |