Bonding of a microwave-absorbing ferrite, TDK IB-004, with copper for the HOM damper of the KEK B-factory SC cavities

Detalles Bibliográficos
Autores principales: Tajima, T, Asano, K, Furuya, T, Iida, S, Ishi, Y, Kijima, Y, Kokura, S, Mitsunobu, S, Takahashi, T, Takashina, H
Lenguaje:eng
Publicado: 1993
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/258525

Internet

http://cds.cern.ch/record/258525

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