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Development of novel fabrication techniques for a silicon microvertex detector unit using the flip-chip bonding method
Autores principales: | , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , |
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Lenguaje: | eng |
Publicado: |
1993
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/259255 |