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Wide bandgap power semiconductor packaging: materials, components, and reliability
| Autor principal: | |
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| Lenguaje: | eng |
| Publicado: |
Elsevier Science & Technology
2018
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2631175 |
| _version_ | 1780959502102691840 |
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| author | Suganuma, Katsuaki |
| author_facet | Suganuma, Katsuaki |
| author_sort | Suganuma, Katsuaki |
| collection | CERN |
| id | cern-2631175 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2018 |
| publisher | Elsevier Science & Technology |
| record_format | invenio |
| spelling | cern-26311752021-04-21T18:45:14Zhttp://cds.cern.ch/record/2631175engSuganuma, KatsuakiWide bandgap power semiconductor packaging: materials, components, and reliabilityEngineeringElsevier Science & Technologyoai:cds.cern.ch:26311752018 |
| spellingShingle | Engineering Suganuma, Katsuaki Wide bandgap power semiconductor packaging: materials, components, and reliability |
| title | Wide bandgap power semiconductor packaging: materials, components, and reliability |
| title_full | Wide bandgap power semiconductor packaging: materials, components, and reliability |
| title_fullStr | Wide bandgap power semiconductor packaging: materials, components, and reliability |
| title_full_unstemmed | Wide bandgap power semiconductor packaging: materials, components, and reliability |
| title_short | Wide bandgap power semiconductor packaging: materials, components, and reliability |
| title_sort | wide bandgap power semiconductor packaging: materials, components, and reliability |
| topic | Engineering |
| url | http://cds.cern.ch/record/2631175 |
| work_keys_str_mv | AT suganumakatsuaki widebandgappowersemiconductorpackagingmaterialscomponentsandreliability |