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PCB development using HDI-technology and 3D-mounting of chips for MPGD readout
Autores principales: | Jönsson, L., Lundberg, B., Mjörnmark, U., Oskarsson, A., Smirnova, O., Österman, L. |
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Formato: | info:eu-repo/semantics/article |
Lenguaje: | eng |
Publicado: |
2019
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/2661737 |
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