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Advances in embedded and fan-out wafer level packaging technologies
| Autores principales: | , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
John Wiley & Sons
2019
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2671399 |
| _version_ | 1780962394416087040 |
|---|---|
| author | Keser, Beth Kroehnert, Steffen |
| author_facet | Keser, Beth Kroehnert, Steffen |
| author_sort | Keser, Beth |
| collection | CERN |
| id | cern-2671399 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2019 |
| publisher | John Wiley & Sons |
| record_format | invenio |
| spelling | cern-26713992021-04-21T18:25:42Zhttp://cds.cern.ch/record/2671399engKeser, BethKroehnert, SteffenAdvances in embedded and fan-out wafer level packaging technologiesEngineering John Wiley & Sonsoai:cds.cern.ch:26713992019 |
| spellingShingle | Engineering Keser, Beth Kroehnert, Steffen Advances in embedded and fan-out wafer level packaging technologies |
| title | Advances in embedded and fan-out wafer level packaging technologies |
| title_full | Advances in embedded and fan-out wafer level packaging technologies |
| title_fullStr | Advances in embedded and fan-out wafer level packaging technologies |
| title_full_unstemmed | Advances in embedded and fan-out wafer level packaging technologies |
| title_short | Advances in embedded and fan-out wafer level packaging technologies |
| title_sort | advances in embedded and fan-out wafer level packaging technologies |
| topic | Engineering |
| url | http://cds.cern.ch/record/2671399 |
| work_keys_str_mv | AT keserbeth advancesinembeddedandfanoutwaferlevelpackagingtechnologies AT kroehnertsteffen advancesinembeddedandfanoutwaferlevelpackagingtechnologies |