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Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement
| Autores principales: | , |
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| Lenguaje: | eng |
| Publicado: |
CRC Press
2019
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2675444 |
| _version_ | 1780962640917430272 |
|---|---|
| author | Ma, Yue Gontrand, Christian |
| author_facet | Ma, Yue Gontrand, Christian |
| author_sort | Ma, Yue |
| collection | CERN |
| id | cern-2675444 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2019 |
| publisher | CRC Press |
| record_format | invenio |
| spelling | cern-26754442021-04-21T18:24:49Zhttp://cds.cern.ch/record/2675444engMa, YueGontrand, ChristianPower, thermal, noise and signal integrity issues on substrate/interconnects entanglementEngineeringCRC Pressoai:cds.cern.ch:26754442019 |
| spellingShingle | Engineering Ma, Yue Gontrand, Christian Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| title | Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| title_full | Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| title_fullStr | Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| title_full_unstemmed | Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| title_short | Power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| title_sort | power, thermal, noise and signal integrity issues on substrate/interconnects entanglement |
| topic | Engineering |
| url | http://cds.cern.ch/record/2675444 |
| work_keys_str_mv | AT mayue powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement AT gontrandchristian powerthermalnoiseandsignalintegrityissuesonsubstrateinterconnectsentanglement |