Modeling, analysis, design and tests for electronics packaging beyond Moore

Detalles Bibliográficos
Autores principales: Zhao, Wensheng, Che, Faxing, Lin, Tingyu, Jin, Cheng
Lenguaje:eng
Publicado: Elsevier Science & Technology 2019
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/2707596

Internet

http://cds.cern.ch/record/2707596

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