Modeling, analysis, design and tests for electronics packaging beyond Moore

Detalles Bibliográficos
Autores principales: Zhao, Wensheng, Che, Faxing, Lin, Tingyu, Jin, Cheng
Lenguaje:eng
Publicado: Elsevier Science & Technology 2019
Materias:
Engineering
Acceso en línea:http://cds.cern.ch/record/2707596
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author Zhao, Wensheng
Che, Faxing
Lin, Tingyu
Jin, Cheng
author_facet Zhao, Wensheng
Che, Faxing
Lin, Tingyu
Jin, Cheng
author_sort Zhao, Wensheng
collection CERN
id cern-2707596
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2019
publisher Elsevier Science & Technology
record_format invenio
spelling cern-27075962021-04-21T18:10:59Zhttp://cds.cern.ch/record/2707596engZhao, WenshengChe, FaxingLin, TingyuJin, ChengModeling, analysis, design and tests for electronics packaging beyond MooreEngineeringElsevier Science & Technologyoai:cds.cern.ch:27075962019
spellingShingle Engineering
Zhao, Wensheng
Che, Faxing
Lin, Tingyu
Jin, Cheng
Modeling, analysis, design and tests for electronics packaging beyond Moore
title Modeling, analysis, design and tests for electronics packaging beyond Moore
title_full Modeling, analysis, design and tests for electronics packaging beyond Moore
title_fullStr Modeling, analysis, design and tests for electronics packaging beyond Moore
title_full_unstemmed Modeling, analysis, design and tests for electronics packaging beyond Moore
title_short Modeling, analysis, design and tests for electronics packaging beyond Moore
title_sort modeling, analysis, design and tests for electronics packaging beyond moore
topic Engineering
url http://cds.cern.ch/record/2707596
work_keys_str_mv AT zhaowensheng modelinganalysisdesignandtestsforelectronicspackagingbeyondmoore
AT chefaxing modelinganalysisdesignandtestsforelectronicspackagingbeyondmoore
AT lintingyu modelinganalysisdesignandtestsforelectronicspackagingbeyondmoore
AT jincheng modelinganalysisdesignandtestsforelectronicspackagingbeyondmoore

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