Cargando…
Foldable flex and thinned silicon multichip packaging technology
| Autor principal: | |
|---|---|
| Lenguaje: | eng |
| Publicado: |
Springer
2003
|
| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/2757424 |
| _version_ | 1780969934233272320 |
|---|---|
| author | Balde, John W |
| author_facet | Balde, John W |
| author_sort | Balde, John W |
| collection | CERN |
| id | cern-2757424 |
| institution | Organización Europea para la Investigación Nuclear |
| language | eng |
| publishDate | 2003 |
| publisher | Springer |
| record_format | invenio |
| spelling | cern-27574242021-04-21T16:41:17Zhttp://cds.cern.ch/record/2757424engBalde, John WFoldable flex and thinned silicon multichip packaging technologyXXSpringeroai:cds.cern.ch:27574242003 |
| spellingShingle | XX Balde, John W Foldable flex and thinned silicon multichip packaging technology |
| title | Foldable flex and thinned silicon multichip packaging technology |
| title_full | Foldable flex and thinned silicon multichip packaging technology |
| title_fullStr | Foldable flex and thinned silicon multichip packaging technology |
| title_full_unstemmed | Foldable flex and thinned silicon multichip packaging technology |
| title_short | Foldable flex and thinned silicon multichip packaging technology |
| title_sort | foldable flex and thinned silicon multichip packaging technology |
| topic | XX |
| url | http://cds.cern.ch/record/2757424 |
| work_keys_str_mv | AT baldejohnw foldableflexandthinnedsiliconmultichippackagingtechnology |