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Understanding thermally induced stresses in ATLAS ITk Pixel modules
The stresses induced by differences in the coefficients of thermal expansion in the module stack can lead to stress on the solder bumps that is sufficient to cause the bump to break. FEA simulations have been made to understand the stresses and how they can be mitigated. FEA simulations highlighted...
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| Lenguaje: | eng |
| Publicado: |
2021
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| Acceso en línea: | http://cds.cern.ch/record/2789992 |