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First steps towards interlocking modular microfluidic cooling substrates (i-MμCS) for future silicon tracking detectors in High Energy Physics (HEP)
In future High Energy Physics detectors, the coverage of large surfaces with silicon pixel chip sensors poses a challenge for the sensors positioning, for their cooling, assembly, and interconnection. The use of a cooling substrate on which the sensors are glued is typically limited by the bulky and...
| Autores principales: | , , |
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| Lenguaje: | eng |
| Publicado: |
2022
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| Acceso en línea: | https://dx.doi.org/10.1016/j.mee.2022.111707 http://cds.cern.ch/record/2801566 |