Cargando…
The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
The presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusio...
| Autores principales: | , , , , , , , , , |
|---|---|
| Lenguaje: | eng |
| Publicado: |
2019
|
| Materias: | |
| Acceso en línea: | https://dx.doi.org/10.1149/2.1211908jes http://cds.cern.ch/record/2805298 |