The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications

The presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusio...

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Autores principales: Amador, L Lain, Rolet, J, Doche, M-L, Massuti-Ballester, P, Gigandet, M-P, Moutarlier, V, Taborelli, M, Ferreira, L M A, Chiggiato, P, Hihn, J-Y
Lenguaje:eng
Publicado: 2019
Materias:
Accelerators and Storage Rings
Acceso en línea:https://dx.doi.org/10.1149/2.1211908jes
http://cds.cern.ch/record/2805298
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author Amador, L Lain
Rolet, J
Doche, M-L
Massuti-Ballester, P
Gigandet, M-P
Moutarlier, V
Taborelli, M
Ferreira, L M A
Chiggiato, P
Hihn, J-Y
author_facet Amador, L Lain
Rolet, J
Doche, M-L
Massuti-Ballester, P
Gigandet, M-P
Moutarlier, V
Taborelli, M
Ferreira, L M A
Chiggiato, P
Hihn, J-Y
author_sort Amador, L Lain
collection CERN
description The presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusion limited range starts. TDS experiments show that hydrogen is trapped in the copper samples in two different forms. Hydrogen diffused from copper vacancies was found on all samples at an outgassing temperature of around 450°C. For samples with long pulse times, an additional H2 outgassing peak was found at around 600°C. XRD measurements allowed us to determine the preferential orientation of the plated samples and to monitor lattice parameter evolution with increasing temperature
id cern-2805298
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2019
record_format invenio
spelling cern-28052982022-10-28T12:44:37Zdoi:10.1149/2.1211908jeshttp://cds.cern.ch/record/2805298engAmador, L LainRolet, JDoche, M-LMassuti-Ballester, PGigandet, M-PMoutarlier, VTaborelli, MFerreira, L M AChiggiato, PHihn, J-YThe Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum ApplicationsAccelerators and Storage RingsThe presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusion limited range starts. TDS experiments show that hydrogen is trapped in the copper samples in two different forms. Hydrogen diffused from copper vacancies was found on all samples at an outgassing temperature of around 450°C. For samples with long pulse times, an additional H2 outgassing peak was found at around 600°C. XRD measurements allowed us to determine the preferential orientation of the plated samples and to monitor lattice parameter evolution with increasing temperatureoai:cds.cern.ch:28052982019
spellingShingle Accelerators and Storage Rings
Amador, L Lain
Rolet, J
Doche, M-L
Massuti-Ballester, P
Gigandet, M-P
Moutarlier, V
Taborelli, M
Ferreira, L M A
Chiggiato, P
Hihn, J-Y
The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
title The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
title_full The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
title_fullStr The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
title_full_unstemmed The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
title_short The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications
title_sort effect of pulsed current and organic additives on hydrogen incorporation in electroformed copper used in ultrahigh vacuum applications
topic Accelerators and Storage Rings
url https://dx.doi.org/10.1149/2.1211908jes
http://cds.cern.ch/record/2805298
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