The Effect of Pulsed Current and Organic Additives on Hydrogen Incorporation in Electroformed Copper Used in Ultrahigh Vacuum Applications

The presence of hydrogen in electroformed copper from two different acidic copper sulfate solutions was evaluated: an additive-free solution and a solution including a sugar. D-xylose addition is found to inhibit H incorporation and allows the use of higher cathodic pulses before the copper diffusio...

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Detalles Bibliográficos
Autores principales: Amador, L Lain, Rolet, J, Doche, M-L, Massuti-Ballester, P, Gigandet, M-P, Moutarlier, V, Taborelli, M, Ferreira, L M A, Chiggiato, P, Hihn, J-Y
Lenguaje:eng
Publicado: 2019
Materias:
Accelerators and Storage Rings
Acceso en línea:https://dx.doi.org/10.1149/2.1211908jes
http://cds.cern.ch/record/2805298

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