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A multi-chip module for physics experiments
MCMs are widely adopted as assembly solutions for multi-die based systems, where area, performance, and costs are critical constraints. This paper describes both the project strategies and production flow that are to be adopted to realize an MCM-D for data acquisition in high-energy physics experime...
Autores principales: | , , , , , |
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Lenguaje: | eng |
Publicado: |
1999
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Materias: | |
Acceso en línea: | http://cds.cern.ch/record/435516 |