A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding

Detalles Bibliográficos
Autores principales: Cihangir, S, Appel, J A, Christian, D, Ghiodoni, G, Reygadas, F, Kwan, S
Lenguaje:eng
Publicado: CERN 2001
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.5170/CERN-2001-005.101
http://cds.cern.ch/record/527191

Internet

https://dx.doi.org/10.5170/CERN-2001-005.101
http://cds.cern.ch/record/527191

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