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A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding

Detalles Bibliográficos
Autores principales: Cihangir, S, Appel, J A, Christian, D, Ghiodoni, G, Reygadas, F, Kwan, S
Lenguaje:eng
Publicado: CERN 2001
Materias:
Acceso en línea:https://dx.doi.org/10.5170/CERN-2001-005.101
http://cds.cern.ch/record/527191
_version_ 1780897929441050624
author Cihangir, S
Appel, J A
Christian, D
Ghiodoni, G
Reygadas, F
Kwan, S
author_facet Cihangir, S
Appel, J A
Christian, D
Ghiodoni, G
Reygadas, F
Kwan, S
author_sort Cihangir, S
collection CERN
id cern-527191
institution Organización Europea para la Investigación Nuclear
language eng
publishDate 2001
publisher CERN
record_format invenio
spelling cern-5271912019-09-30T06:29:59Zdoi:10.5170/CERN-2001-005.101http://cds.cern.ch/record/527191engCihangir, SAppel, J AChristian, DGhiodoni, GReygadas, FKwan, SA Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump BondingDetectors and Experimental TechniquesCERNFERMILAB-CONF-2001-251-Eoai:cds.cern.ch:5271912001
spellingShingle Detectors and Experimental Techniques
Cihangir, S
Appel, J A
Christian, D
Ghiodoni, G
Reygadas, F
Kwan, S
A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
title A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
title_full A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
title_fullStr A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
title_full_unstemmed A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
title_short A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding
title_sort study of thermal cycling and radiation effects on indium and solder bump bonding
topic Detectors and Experimental Techniques
url https://dx.doi.org/10.5170/CERN-2001-005.101
http://cds.cern.ch/record/527191
work_keys_str_mv AT cihangirs astudyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT appelja astudyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT christiand astudyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT ghiodonig astudyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT reygadasf astudyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT kwans astudyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT cihangirs studyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT appelja studyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT christiand studyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT ghiodonig studyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT reygadasf studyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding
AT kwans studyofthermalcyclingandradiationeffectsonindiumandsolderbumpbonding