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A Study of Thermal Cycling and Radiation Effects on Indium and Solder Bump Bonding

Detalles Bibliográficos
Autores principales:	Cihangir, S, Appel, J A, Christian, D, Ghiodoni, G, Reygadas, F, Kwan, S
Lenguaje:	eng
Publicado:	CERN 2001
Materias:	Detectors and Experimental Techniques
Acceso en línea:	https://dx.doi.org/10.5170/CERN-2001-005.101 http://cds.cern.ch/record/527191

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