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Spectroscopic imaging of x-rays: a new look

In recent hybrid imaging devices a segmented (50-100 mu m) semiconductor sensor matrix is matched to a separate readout chip made in some standard silicon CMOS technology. The large number of contacts are made by high-density bump bonding interconnect technology. Extended functionality with hundreds...

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Detalles Bibliográficos
Autor principal: Heijne, Erik H M
Lenguaje:eng
Publicado: 2004
Materias:
Acceso en línea:http://cds.cern.ch/record/818343