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Spectroscopic imaging of x-rays: a new look
In recent hybrid imaging devices a segmented (50-100 mu m) semiconductor sensor matrix is matched to a separate readout chip made in some standard silicon CMOS technology. The large number of contacts are made by high-density bump bonding interconnect technology. Extended functionality with hundreds...
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| Lenguaje: | eng |
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2004
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| Acceso en línea: | http://cds.cern.ch/record/818343 |
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