An innovative "ChemicalVia" process for the production of high density interconnect printed circuit boards The ATLAS muon chamber quality control with the X-ray tomograph at CERN

The ChemicalVia process, patented by CERN, provides a new method of making microvias in high-density multilayer printed circuit boards of different types, such as sequential build-up (SBU), high density interconnected (HDI), or laminated multi-chip modules (MCM-L). The process uses chemical etching...

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Detalles Bibliográficos
Autores principales: Da Silva, Vitor, De Oliveira, Rui, Watts, David, Van der Bij, Erik, Banhidi, Z, Berbiers, Julien, Lampl, W, Marchesotti, M, Rangod, Stephane, Sbrissa, E, Schuh, S, Voss, Rüdiger, Zhuravlov, V
Lenguaje:eng
Publicado: 2004
Materias:
Detectors and Experimental Techniques
Acceso en línea:https://dx.doi.org/10.1108/03056120410539885
http://cds.cern.ch/record/818481

Internet

https://dx.doi.org/10.1108/03056120410539885
http://cds.cern.ch/record/818481

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