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Mechanical and Thermal Characterisation of a TT Half-Module Prototype
This note describes the mechanical effects of thermal cycles on a TT half-module, to demonstrate that the detectors can withstand the expected thermal gradients without damage. The stress transferred by the carbon fiber rails and the ceramic to the silicon sensors was investigated, and the deformati...
| Autores principales: | , , , |
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| Lenguaje: | eng |
| Publicado: |
2005
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| Materias: | |
| Acceso en línea: | http://cds.cern.ch/record/821926 |