Mechanical and Thermal Characterisation of a TT Half-Module Prototype

This note describes the mechanical effects of thermal cycles on a TT half-module, to demonstrate that the detectors can withstand the expected thermal gradients without damage. The stress transferred by the carbon fiber rails and the ceramic to the silicon sensors was investigated, and the deformation that occurred during these tests was measured by strain gauges that were attached to sensors on a test half-module. In addition, heat transfer through the carbon fiber rails was studied. Furthermore, we present a comparison of different materials proposed to build the carbon fiber rails of the modules.