Development of an Indium Bump Bond Process for Silicon Pixel Detectors at PSI

The hybrid pixel detectors used in the high energy physics experiments currently under construction use a three dimensional connection technique, the so-called bump bonding. As the pitch below 100um, required in these applications, cannot be fullfilled with standard industrial processes (e.g. the IB...

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Detalles Bibliográficos
Autores principales: Brönnimann, C, Glaus, F, Gobrecht, J, Heising, S, Horisberger, M, Horisberger, R P, Kästli, H C, Lehmann, J, Rohe, T, Streuli, S
Lenguaje:eng
Publicado: 2005
Materias:
Other Fields of Physics
Acceso en línea:https://dx.doi.org/10.1016/j.nima.2006.05.011
http://cds.cern.ch/record/893010

Internet

https://dx.doi.org/10.1016/j.nima.2006.05.011
http://cds.cern.ch/record/893010

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