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Spectroscopic imaging of X-rays: anew look
In recent hybrid imaging devices a segmented (50-100mum) semiconductor sensor matrix is matched to a separate readout chip made in some standard silicon CMOS technology. The large number of contacts are made by high-density bump bonding interconnect technology. Extended functionality with hundreds o...
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| Lenguaje: | eng |
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2003
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| Acceso en línea: | http://cds.cern.ch/record/908908 |