Cargando…

Production chain of CMS pixel modules

The pictures show the production chain of pixel modules for the CMS detector. Fig.1: overview of the assembly procedure. Fig.2: bump bonding with ReadOut Chip (ROC) connected to the sensor. Fig.3: glueing a raw module onto the baseplate strips. Fig.4: glueing of the High Density Interconnect (HDI) o...

Descripción completa

Detalles Bibliográficos
Publicado: 2006
Materias:
Acceso en línea:http://cds.cern.ch/record/938898