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Production chain of CMS pixel modules
The pictures show the production chain of pixel modules for the CMS detector. Fig.1: overview of the assembly procedure. Fig.2: bump bonding with ReadOut Chip (ROC) connected to the sensor. Fig.3: glueing a raw module onto the baseplate strips. Fig.4: glueing of the High Density Interconnect (HDI) o...
| Publicado: |
2006
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| Acceso en línea: | http://cds.cern.ch/record/938898 |